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High Tg170

Single LayerCircuit board board

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板材:High Tg170

层数:14层

最小孔径:Φ0.45mm

板厚:3.2mm

最小宽/间距:0.2/0.2mm

结构:通孔厚铜板(内层4oz)

表面处理:化金

用途:电源

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